The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Aug. 11, 2015
Applicant:
Lawrence Livermore National Security, Llc, Livermore, CA (US);
Inventors:
Andrew J. Pascall, Livermore, CA (US);
Hannah Grace Coe, Anchor Point, AK (US);
Julie A. Jackson, Livermore, CA (US);
Susant K. Patra, Brentwood, CA (US);
Assignee:
Lawrence Livermore National Security, LLC, Livermore, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 13/02 (2006.01); B33Y 10/00 (2015.01); B23P 15/26 (2006.01); C25D 1/00 (2006.01); C25D 13/12 (2006.01); C25D 15/00 (2006.01); C25D 15/02 (2006.01); F28F 21/04 (2006.01); F28F 3/12 (2006.01); B33Y 80/00 (2015.01); F28F 21/02 (2006.01); F28F 21/08 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
C25D 13/02 (2013.01); B23P 15/26 (2013.01); B33Y 10/00 (2014.12); C25D 1/003 (2013.01); C25D 13/12 (2013.01); C25D 15/00 (2013.01); C25D 15/02 (2013.01); F28F 3/12 (2013.01); F28F 21/04 (2013.01); B23P 2700/10 (2013.01); B33Y 80/00 (2014.12); F28D 2021/0029 (2013.01); F28F 21/02 (2013.01); F28F 21/08 (2013.01); F28F 2260/02 (2013.01); Y10T 29/4935 (2015.01);
Abstract
A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.