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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10221487 B1

PDFFull Text
Date of Patent:
Mar. 05, 2019

Filed:

May. 30, 2014

Metal foil for electromagnetic shielding, electromagnetic shielding material and shielded cable

Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Koichiro Tanaka, Ibaraki, JP;

Assignee:

JX Nippon Mining & Metals Corporation, Tokyo, JP;

Attorney:

Jenkins, Wilson, Taylor & Hunt, P.A.

Primary Examiner:

Adam Krupicka

Int. Cl.
CPC ...
C23C 28/02 (2006.01); C25D 5/12 (2006.01); C23C 30/00 (2006.01); H05K 9/00 (2006.01); B32B 15/00 (2006.01); C25D 5/50 (2006.01); C25D 7/06 (2006.01); C23C 18/54 (2006.01); C25D 3/12 (2006.01); C25D 3/32 (2006.01); C25D 3/56 (2006.01);
U.S. Cl.
CPC ...
C23C 28/021 (2013.01); B32B 15/00 (2013.01); C23C 18/54 (2013.01); C23C 28/02 (2013.01); C23C 30/00 (2013.01); C25D 5/12 (2013.01); C25D 5/505 (2013.01); C25D 7/0614 (2013.01); H05K 9/00 (2013.01); H05K 9/0088 (2013.01); C25D 3/12 (2013.01); C25D 3/32 (2013.01); C25D 3/562 (2013.01);
Abstract

A metal foil for electromagnetic shielding, comprising a baseconsisting of a metal foil, an underlayerincluding Ni formed on one or both surfaces of the base, and a Sn—Ni alloy layerformed on a surface of the underlayer, wherein the Sn—Ni alloy layer includes 20 to 80 weight % of Sn, and when a total deposition amount of Sn is represented by T[μg/dm], a percentage of Sn in the Sn—Ni alloy is represented by A[weight %], a total deposition amount of Ni is represented by T[μg/dm], and a percentage of Ni in the Sn—Ni alloy is represented by A[weight %], T: 500 to 91000 μg/dm, T: 2200 to 236000 μg/dm, 170000=>{T−T×(A/A)}=>1700.

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Tanaka, Koichiro. (2019). Metal foil for electromagnetic shielding, electromagnetic shielding material and shielded cable (U.S. Patent No. 10221487). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10221487

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