The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Mar. 02, 2018
Kaneka Corporation, Osaka, JP;
Toru Yoshida, Osaka, JP;
Shintaro Miura, Osaka, JP;
KANEKA CORPORATION, Osaka, JP;
Abstract
A method of producing a polypropylene resin in-mold expanded product, includes: placing polypropylene resin particles obtained from a base material resin having a melting point of 140° C. to 150° C., the base material resin comprising: a polypropylene resin A comprising 3 weight % to 15 weight % of 1-butene and having a melting point of 130° C. to 140° C.; and a polypropylene resin B having a melting point of 145° C. to 165° C., water, and an inorganic gas foaming agent in a pressure-resistant container, forming a mixture, dispersing the polypropylene resin particles while stirring the mixture, obtaining a dispersion liquid, increasing a temperature and a pressure in the pressure-resistant container, releasing the dispersion liquid from the pressure-resistant container into a region having a pressure lower than the pressure in the pressure-resistant container, producing expanded polypropylene resin particles; and filling a mold with the expanded polypropylene resin particles, and then heating the expanded polypropylene resin particles.