The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Mar. 16, 2017
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

Daesung Lee, Palo Alto, CA (US);

Jongwoo Shin, Pleasanton, CA (US);

Jong Il Shin, San Jose, CA (US);

Peter Smeys, San Jose, CA (US);

Martin Lim, San Mateo, CA (US);

Assignee:

INVENSENSE, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01); B81B 7/02 (2006.01);
U.S. Cl.
CPC ...
B81C 1/0023 (2013.01); B81B 7/0038 (2013.01); B81B 7/0041 (2013.01); B81B 7/02 (2013.01); B81C 1/00285 (2013.01); B81B 2201/0228 (2013.01); B81B 2207/017 (2013.01); B81C 2203/019 (2013.01); B81C 2203/035 (2013.01); B81C 2203/0785 (2013.01);
Abstract

An integrated MEMS device comprises two substrates where the first and second substrates are coupled together and have two enclosures there between. One of the first and second substrates includes an outgassing source layer and an outgassing barrier layer to adjust pressure within the two enclosures. The method includes depositing and patterning an outgassing source layer and a first outgassing barrier layer on the substrate, resulting in two cross-sections. In one of the two cross-sections a top surface of the outgassing source layer is not covered by the outgassing barrier layer and in the other of the two cross-sections the outgassing source layer is encapsulated in the outgassing barrier layer. The method also includes depositing conformally a second outgassing barrier layer and etching the second outgassing barrier layer such that a spacer of the second outgassing barrier layer is left on sidewalls of the outgassing source layer.


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