The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Sep. 13, 2016
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Lyle R. Deobald, Shoreline, WA (US);

Matthew A. Dilligan, Seattle, WA (US);

Aaron N. Rinn, Edmonds, WA (US);

Madhavadas Ramnath, Mukilteo, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64C 1/06 (2006.01); B64C 3/18 (2006.01); B29C 65/48 (2006.01); B29C 65/52 (2006.01); B29C 65/54 (2006.01); B64C 3/26 (2006.01); B29C 65/00 (2006.01); B64C 3/24 (2006.01); B32B 7/12 (2006.01); B32B 3/26 (2006.01); B32B 3/28 (2006.01); B29D 99/00 (2010.01); B29L 31/30 (2006.01); B29L 31/00 (2006.01); B64C 1/00 (2006.01);
U.S. Cl.
CPC ...
B64C 3/26 (2013.01); B29C 65/48 (2013.01); B29C 65/52 (2013.01); B29C 65/54 (2013.01); B29C 66/0224 (2013.01); B29C 66/0246 (2013.01); B29C 66/02242 (2013.01); B29C 66/02245 (2013.01); B29C 66/303 (2013.01); B29C 66/30321 (2013.01); B29C 66/30325 (2013.01); B29C 66/474 (2013.01); B64C 1/06 (2013.01); B64C 1/064 (2013.01); B64C 3/18 (2013.01); B64C 3/182 (2013.01); B64C 3/185 (2013.01); B29C 65/527 (2013.01); B29C 65/542 (2013.01); B29C 65/546 (2013.01); B29C 65/548 (2013.01); B29C 66/10 (2013.01); B29C 66/20 (2013.01); B29C 66/30322 (2013.01); B29C 66/7315 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29D 99/0003 (2013.01); B29D 99/0014 (2013.01); B29L 2031/001 (2013.01); B29L 2031/008 (2013.01); B29L 2031/3076 (2013.01); B29L 2031/3082 (2013.01); B29L 2031/3085 (2013.01); B32B 3/266 (2013.01); B32B 3/28 (2013.01); B32B 7/12 (2013.01); B32B 2605/18 (2013.01); B32B 2607/00 (2013.01); B64C 3/24 (2013.01); B64C 2001/0072 (2013.01); Y10T 428/24174 (2015.01); Y10T 428/24182 (2015.01); Y10T 428/24322 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/24752 (2015.01); Y10T 428/24777 (2015.01);
Abstract

An open-channel stiffener for stiffening a panel has a bonding flange for bonding the stiffener to the panel through a bondline formed between the bonding flange and the panel to form a stiffened panel. The open-channel stiffener has a cross-sectional shape that aligns, or substantially aligns, a shear center of the stiffener with a centroid of the stiffener and aligns the shear center proximate an edge of the bondline, and removes the need for a radius filler noodle. A plurality of perforations may be formed through the bonding flange to permit an adhesive to wick into the perforations and create a mechanical interlock between the bonding flange and the panel.


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