The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Mar. 03, 2016
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Shuichi Tanaka, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); B81B 7/00 (2006.01); H05K 1/18 (2006.01); H01L 41/04 (2006.01); H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14274 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1607 (2013.01); B41J 2/1623 (2013.01); B41J 2/1626 (2013.01); B41J 2/1631 (2013.01); B81B 7/007 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14491 (2013.01); B81B 2201/052 (2013.01); B81B 2203/04 (2013.01); B81B 2207/012 (2013.01); H01L 41/042 (2013.01); H01L 41/0472 (2013.01); H05K 1/183 (2013.01);
Abstract

Provided are an MEMS device, a head, and a liquid jet device in which substrates are inhibited from warping, so that a primary electrode and a secondary electrode can be reliably connected to each other. Included are a primary substrateprovided with a bumpincluding a primary electrode, and a secondary substrateprovided with a secondary electrodeon a bottom surface of a recessed portionformed by an adhesive layer. The primary substrateand the secondary substrateare joined together with the adhesive layer, the primary electrodeis electrically connected to the secondary electrodewith the bumpinserted into the recessed portion, and part of the bumpand the adhesive layerforming the recessed portionoverlap each other in a direction in which the bumpis inserted into the recessed portion


Find Patent Forward Citations

Loading…