The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2019
Filed:
Dec. 22, 2015
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Kohei Utsunomiya, Nagano, JP;
Satoshi Yamazaki, Nagano, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44C 1/17 (2006.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01); B29C 64/112 (2017.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
B33Y 30/00 (2014.12); B29C 64/112 (2017.08); B33Y 10/00 (2014.12); B29C 2035/0827 (2013.01);
Abstract
A solid object shaping apparatus, which includes a head unit that ejects a liquid, and a curing unit that cures the liquid so as to form a block, shapes a solid object by using the blocks, and can cure the liquid in a plurality of curing modes including a first curing mode in which the liquid is cured so that the block with a first size is formed by a first reference amount of liquid, and a second curing mode in which the liquid is cured so that the block with a second size in which a surface area is larger than a surface area in the first size is formed by using the first reference amount of liquid.