The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

May. 23, 2014
Applicant:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

Inventors:

Tsugumaru Yamashita, Tokyo, JP;

Yoshihito Fujita, Tokyo, JP;

Kiyotaka Nakagawa, Tokyo, JP;

Shinnosuke Osafune, Tokyo, JP;

Haruhiko Niitani, Tokyo, JP;

Yoshikatsu Sato, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23P 23/04 (2006.01); F02M 61/16 (2006.01); B23K 37/02 (2006.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); B23K 26/0622 (2014.01); B23K 26/382 (2014.01);
U.S. Cl.
CPC ...
B23K 26/0093 (2013.01); B23K 26/0608 (2013.01); B23K 26/0624 (2015.10); B23K 26/0652 (2013.01); B23K 26/083 (2013.01); B23K 26/0869 (2013.01); B23K 26/389 (2015.10); B23K 37/0235 (2013.01); B23P 23/04 (2013.01); F02M 61/168 (2013.01); F02M 2200/8069 (2013.01);
Abstract

Provided are a combined machining apparatus and a combined machining method capable of performing machining with higher accuracy and at a high speed. The apparatus has a stage unit; a mechanical machining unit including a mechanical machining head having a tool configured to machine a workpiece; a laser machining unit including a laser machining head configured to emit laser for machining the workpiece; a moving unit; and a control unit that controls the operation of each unit, in which the laser machining head has a laser turning unit that turns laser relative to the workpiece, and a condensing optical system that focuses the laser turned by the laser turning unit, and a position at which the workpiece is irradiated with the laser is rotated by the laser turning unit.


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