The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Nov. 27, 2017
Applicant:

Nokia Solutions and Networks Oy, Espoo, FI;

Inventors:

Todd Betz, Corinth, TX (US);

Michael Bartlett, Hurst, TX (US);

Andrew Morrison, Euless, TX (US);

Earl Ponceti, McKinney, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/14 (2006.01); H01L 23/367 (2006.01); H01R 24/50 (2011.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); H01L 23/3672 (2013.01); H01R 24/50 (2013.01); H05K 1/141 (2013.01); H05K 7/20154 (2013.01); H05K 3/366 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A connector assembly and heat sink configured to be received by a radio unit are provided. An example connector assembly includes a printed wiring board (PWB) at least partially disposed within the radio unit when in an operational configuration, and the PWB defines an extension at least partially disposed exterior to the radio unit when in the operational configuration. The connector assembly includes one or more optoelectronic components configured to convert between optical signals and electrical signals supported by the PWB, and at least a portion of the one or more optoelectronic components are disposed on the extension of the PWB. The connector assembly also includes a heat sink housing attached to the PWB that encloses the extension of the PWB and optoelectronic components disposed on the extension in order to dissipate heat from the optoelectronic components to an exterior environment of the connector assembly.


Find Patent Forward Citations

Loading…