The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Feb. 27, 2017
Applicant:

Motorola Mobility Llc, Chicago, IL (US);

Inventors:

Md Rashidul Islam, Lombard, IL (US);

Eric Krenz, Crystal Lake, IL (US);

Hugh Smith, Palatine, IL (US);

Istvan Szini, Grayslake, IL (US);

Assignee:

Motorola Mobility LLC, Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H05K 3/30 (2006.01); G06F 1/16 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H01Q 19/06 (2006.01); H01Q 19/10 (2006.01); H01Q 19/13 (2006.01); H01Q 19/32 (2006.01); H01Q 21/08 (2006.01); H01Q 9/30 (2006.01); H01Q 21/20 (2006.01);
U.S. Cl.
CPC ...
H05K 3/30 (2013.01); G06F 1/1684 (2013.01); H01Q 1/243 (2013.01); H01Q 19/06 (2013.01); H01Q 19/102 (2013.01); H01Q 19/13 (2013.01); H01Q 19/32 (2013.01); H01Q 21/08 (2013.01); H05K 1/0243 (2013.01); H05K 1/18 (2013.01); H05K 3/4038 (2013.01); H01Q 9/30 (2013.01); H01Q 21/205 (2013.01);
Abstract

An antenna assembly is formed in a multilayer printed circuit board (PCB) for transceiving in a millimeter wave (mmWave) frequency band. A ground plane is formed on at least a portion of a planar surface of the multilayer PCB. Two metal components are physically attached to the multilayer PCB and electrically coupled to the ground plane. A monopole antenna is positioned vertically through one or more layers of the multilayer PCB. The antenna is positioned proximate to one lateral side of the multilayer PCB, and aligned between the two metal components. Vertical stubs are formed through the multilayer PCB, vertically aligned with the monopole antenna, and spaced to a side of the monopole antenna opposite to the one lateral side of the multilayer PCB. Each vertical stub is electrically grounded to the ground plane. The two metal components and the vertical stubs shape beam directivity of the monopole antenna.


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