The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Oct. 31, 2014
Applicants:

Ppg Industries Ohio, Inc., Cleveland, OH (US);

Si-cal Technologies, Inc., Westborough, MA (US);

Inventors:

Jaye Tyler, Providence, RI (US);

Paul F. Cheetham, Wexford, PA (US);

Darren Burn, Enfield, CT (US);

Gregory J. McCollum, Gibsonia, PA (US);

Assignee:

PPG Industries Ohio, Inc., Cleveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/06 (2006.01); B44C 1/24 (2006.01); B44C 3/02 (2006.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01); H05K 3/20 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); B32B 37/00 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H05K 3/207 (2013.01); H01L 21/6835 (2013.01); H05K 3/007 (2013.01); H05K 3/0017 (2013.01); H05K 3/38 (2013.01); H05K 3/4611 (2013.01); B32B 7/06 (2013.01); B32B 37/025 (2013.01); B32B 38/10 (2013.01); B32B 2037/268 (2013.01); B44C 1/24 (2013.01); B44C 3/02 (2013.01); H05K 1/095 (2013.01); H05K 1/16 (2013.01); H05K 3/386 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/0999 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/1545 (2013.01);
Abstract

Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200° F. to 450° F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed.


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