The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Nov. 18, 2015
Applicant:

Goertek Inc., WeiFang, CN;

Inventors:

Zhaopeng Li, WeiFang, CN;

Huawei Liu, WeiFang, CN;

Xueping Song, WeiFang, CN;

Zhilei Han, WeiFang, CN;

Assignee:

GOERTEK INC., Weifang, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 1/02 (2013.01); H04R 1/023 (2013.01); H04R 1/025 (2013.01); H04R 31/00 (2013.01);
Abstract

Disclosed is a loudspeaker module comprising a module housing, wherein a loudspeaker unit is accommodated in the module housing; the loudspeaker unit comprises a unit housing and a unit front cover; an end surface of a sidewall of at least one side of the unit housing is provided with an ultrasonic surface welded to the module housing by means of ultrasound; and an ultrasonic line bonded with the ultrasonic surface by means of ultrasound is provided at a position on the module housing corresponding to the ultrasonic surface. The loudspeaker module of the present invention solves the technical problems of a complex assembly process, poor sealing performance and poor appearance of the loudspeaker module in the prior art, and the loudspeaker module of the present invention has a simple assembly process, good sealing performance, high quality appearance, excellent acoustic performance, high production efficiency and low production cost.


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