The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Mar. 17, 2016
Applicant:

Innochips Technology Co., Ltd., Ansan-Si, Gyeonggi-Do, KR;

Inventors:

In Kil Park, Seongnam-Si, KR;

Tae Hyung Noh, Siheung-Si, KR;

Gyeong Tae Kim, Ansan-Si, KR;

Myung Ho Lee, Ansan-Si, KR;

Tae Geun Seo, Osan-Si, KR;

Min Soo Lee, Daejeon, KR;

Song Yeon Lee, Ansan-Si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 1/00 (2006.01); H01G 4/30 (2006.01); H01G 4/40 (2006.01); H01F 17/00 (2006.01); H01F 27/28 (2006.01); H01G 4/005 (2006.01); H03H 7/01 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H03H 1/00 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01G 4/005 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); H03H 7/0115 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0026 (2013.01); H01F 2027/2809 (2013.01); H01G 4/232 (2013.01); H03H 2001/0085 (2013.01);
Abstract

Provided is a laminated chip device including a first laminate in which a plurality of conductor patterns formed on a plurality of sheets are connected to each other through a via formed to penetrate at least a sheet, and a second laminate provided over or below the first laminate and having a plurality of internal electrode patterns formed on a plurality of sheets, and the internal electrode patterns have a non-conductive region in at least a portion of an area corresponding to the via.


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