The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
May. 16, 2017
Applicant:
Nxp B.v., Eindhoven, NL;
Inventors:
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H03F 1/30 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H03F 1/02 (2006.01); H03F 3/195 (2006.01); H03F 3/213 (2006.01); G01K 7/01 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H03F 1/30 (2013.01); G01K 7/01 (2013.01); H01L 23/3677 (2013.01); H01L 23/3736 (2013.01); H01L 23/49844 (2013.01); H01L 23/66 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 27/0248 (2013.01); H03F 1/0288 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H01L 2224/0401 (2013.01); H03F 2200/447 (2013.01); H03F 2200/451 (2013.01);
Abstract
A flip chip circuit comprising: a semiconductor substrate; a power amplifier provided on the semiconductor substrate; and a metal pad configured to receive an electrically conductive bump for connecting the flip chip to external circuitry. At least a portion of the power amplifier is positioned directly between the metal pad and the semiconductor substrate.