The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Oct. 12, 2017
Applicant:
Snap Inc., Venice, CA (US);
Inventors:
Yu Jiang Tham, Los Angeles, CA (US);
Nicholas Larson, Playa Vista, CA (US);
Peter Brook, Marina del Rey, CA (US);
Russell Douglas Patton, Marina del Rey, CA (US);
Miran Alhaideri, Los Angeles, CA (US);
Zhihao Hong, Marina del Rey, CA (US);
Assignee:
Snap Inc., Santa Monica, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02J 7/00 (2006.01); H02J 7/04 (2006.01); H02J 7/16 (2006.01); H01R 13/62 (2006.01); G02C 5/14 (2006.01); G02C 11/00 (2006.01); H01L 27/02 (2006.01); H03K 19/0185 (2006.01); H02J 7/34 (2006.01); H04B 3/54 (2006.01); H04B 3/56 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6205 (2013.01); G02C 5/146 (2013.01); G02C 11/10 (2013.01); H01L 27/0266 (2013.01); H02J 7/0029 (2013.01); H02J 7/0034 (2013.01); H02J 7/0045 (2013.01); H02J 7/0068 (2013.01); H02J 7/042 (2013.01); H02J 7/345 (2013.01); H03K 19/018557 (2013.01); G02C 11/00 (2013.01); H02J 2007/004 (2013.01); H02J 2007/0062 (2013.01); H02J 2007/0096 (2013.01); H04B 3/548 (2013.01); H04B 3/56 (2013.01); H04B 2203/547 (2013.01);
Abstract
Methods and devices for wired charging and communication with a wearable device are described. In one embodiment, a symmetrical contact interface comprises a first contact pad and a second contact pad, and particular wired circuitry is coupled to the first and second contact pads to enable charging as well as receive and transmit communications via the contact pads as part of various device states.