The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Mar. 11, 2016
Applicant:

Akoustis, Inc., Huntersville, NC (US);

Inventors:

Alexander Y. Feldman, Huntersville, NC (US);

Mark D. Boomgarden, Huntersville, NC (US);

Michael P. Lewis, Charlotte, NC (US);

Jeffrey B. Shealy, Cornelius, NC (US);

Ramakrishna Vetury, Charlotte, NC (US);

Assignee:

AKOUSTIS, INC., Huntersville, NC (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 3/02 (2006.01); H03H 9/17 (2006.01); H01L 41/29 (2013.01); H01L 41/047 (2006.01); H01L 41/332 (2013.01); H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
H01L 41/29 (2013.01); H01L 41/0477 (2013.01); H01L 41/332 (2013.01); H03H 3/02 (2013.01); H03H 9/02007 (2013.01); H03H 9/02574 (2013.01); H03H 9/02055 (2013.01);
Abstract

A method of manufacture for an acoustic resonator device. The method can include forming a topside metal electrode overlying a piezoelectric substrate with a piezoelectric layer and a seed substrate. A topside micro-trench can be formed within the piezoelectric layer and a topside metal can be formed overlying the topside micro-trench. This topside metal can include a topside metal plug formed within the topside micro-trench. A first backside trench can be formed underlying the topside metal electrode, and a second backside trench can be formed underlying the topside micro-trench. A backside metal electrode can be formed within the first backside trench, while a backside metal plug can be formed within the second backside trench and electrically coupled to the topside metal plug and the backside metal electrode. The topside micro-trench, the topside metal plug, the second backside trench, and the backside metal plug form a micro-via.


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