The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Oct. 30, 2014
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Markus Pindl, Tegernheim, DE;

Thomas Schwarz, Regensburg, DE;

Frank Singer, Regenstauf, DE;

Sandra Sobczyk, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/00 (2010.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/18 (2006.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 31/0203 (2013.01); H01L 31/02322 (2013.01); H01L 31/186 (2013.01); H01L 33/0095 (2013.01); H01L 33/502 (2013.01); H01L 21/568 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/56 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/82 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.


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