The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Dec. 11, 2017
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Takahiro Mori, Ibaraki, JP;

Hiroki Fujii, Ibaraki, JP;

Assignee:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 29/40 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7823 (2013.01); H01L 21/02164 (2013.01); H01L 21/02233 (2013.01); H01L 21/02255 (2013.01); H01L 21/311 (2013.01); H01L 29/0611 (2013.01); H01L 29/0653 (2013.01); H01L 29/0692 (2013.01); H01L 29/0882 (2013.01); H01L 29/1083 (2013.01); H01L 29/401 (2013.01); H01L 29/402 (2013.01); H01L 29/404 (2013.01); H01L 29/407 (2013.01); H01L 29/423 (2013.01); H01L 29/4238 (2013.01); H01L 29/42368 (2013.01); H01L 29/66681 (2013.01); H01L 29/7816 (2013.01); H01L 29/7824 (2013.01); H01L 29/7835 (2013.01); H01L 29/063 (2013.01); H01L 29/1045 (2013.01);
Abstract

A semiconductor device including an isolation insulating film having a first thickness that is located between a drain region and a source region; a gate electrode formed over a region located between the isolation insulating film and the source region and that includes a part serving as a channel; an interlayer insulating film formed so as to cover the gate electrode; and a contact plug formed to reach the inside of the isolation insulating film while penetrating the interlayer insulating film, wherein the contact plug includes a buried part that is formed from the surface of the isolation insulating film up to a depth corresponding to a second thickness thinner than the first thickness.


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