The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Aug. 19, 2016
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Paul A. Nygaard, Carlsbad, CA (US);

Stuart B Molin, San Diego, CA (US);

Michael A Stuber, Rancho Santa Fe, CA (US);

Max Aubain, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/10 (2006.01); H01L 29/06 (2006.01); H01L 21/78 (2006.01); H01L 21/84 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01); H01L 23/00 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1054 (2013.01); H01L 21/78 (2013.01); H01L 21/84 (2013.01); H01L 23/36 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 27/1203 (2013.01); H01L 29/0649 (2013.01); H01L 29/1033 (2013.01); H01L 29/78 (2013.01); H01L 29/7843 (2013.01); H01L 29/7849 (2013.01); H01L 29/78603 (2013.01); H01L 29/78606 (2013.01); H01L 29/78654 (2013.01); H01L 21/76256 (2013.01); H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/80 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/03845 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29186 (2013.01); H01L 2224/29188 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/8022 (2013.01); H01L 2224/80801 (2013.01); H01L 2224/80894 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/8322 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/9212 (2013.01); H01L 2224/92142 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/3011 (2013.01);
Abstract

Embodiments of the present invention provide for the enhancement of transistors in a semiconductor structure using a strain layer. The structure comprises a patterned layer consisting of an excavated region and a pattern region, a strain layer located in the excavated region and on the pattern region, an active layer located above the strain layer, a field effect transistor formed in the active layer, and a handle layer located above the active layer. The field effect transistor comprises a source, a drain, and a channel. The channel lies completely within a lateral extent of the pattern region. The source and the drain each lie only partially within the lateral extent of the pattern region. The strain layer alters a carrier mobility of the channel. In some embodiments, the strain layer is introduced to the back side of a semiconductor-on-insulator structure.


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