The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Apr. 25, 2016
Applicant:
Stmicroelectronics (Rousset) Sas, Rousset, FR;
Inventors:
Nicolas Froidevaux, Aix en Provence, FR;
Yann Bacher, Rousset, FR;
Assignee:
STMicroelectronics (Rousset) SAS, Rousset, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/528 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 23/3107 (2013.01); H01L 23/50 (2013.01); H01L 23/5286 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4912 (2013.01); H01L 2924/14 (2013.01);
Abstract
An integrated circuit includes peripheral conductive pads interconnected by a peripheral conductive track within an integrated circuit chip. The integrated circuit chip further includes internal conductive pads interconnected by an internal conductive track within the integrated circuit chip. A conductive bonding wire external to the integrated circuit chip connects the one peripheral conductive pad to one internal conductive pad. A package encapsulates the integrated circuit chip and the conductive bonding wire.