The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Jul. 22, 2015
Applicant:

University of Virginia Patent Foundation, Charlottesville, VA (US);

Inventors:

Hossein Haj-Hariri, Columbia, SC (US);

Seyed Reza Monazami Miralipour, Boston, MA (US);

Assignee:

University of Virginia Patent Foundation, Charlottesville, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); F28D 15/02 (2006.01); F28F 13/18 (2006.01); F28D 15/04 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); F28D 15/02 (2013.01); F28D 15/0233 (2013.01); F28D 15/046 (2013.01); F28F 13/187 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 28/00 (2013.01); F28D 2015/0225 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06579 (2013.01); H01L 2225/06589 (2013.01);
Abstract

A device and related method that provides a two-phase heat transfer device with a combination of enhanced evaporation and increase cooling capacity. A recess topology is used to increase suction of working fluid toward a heat source. A non-wetting coating or structure may be used to keep working fluid away from the spaces between elongated members of an evaporator and a wetting coating or structure may be used to form thin films of working fluid around the distal regions of elongated members. The devices and method described herein may be used to cool computer chips, the skin of a hypersonic flying object, a parabolic solar collector, a turbine engine blade, or other heat sources that require high heat flux.


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