The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Aug. 04, 2016
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Assignee:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); H01L 23/49541 (2013.01); H01L 23/5226 (2013.01); H01L 23/5386 (2013.01); H01L 23/53228 (2013.01); H01L 25/074 (2013.01); H01L 25/115 (2013.01); H01L 2224/33 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/40 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00014 (2013.01);
Abstract
A semiconductor module includes a substrate, first and second wirings on the substrate, a semiconductor package disposed on the first wiring and having a pair of main electrodes on top and bottom surfaces of the semiconductor package, and a third wiring extending between the top surface of the semiconductor package and the second wiring.