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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10217684 B1

PDFFull Text
Date of Patent:
Feb. 26, 2019

Filed:

Jun. 14, 2016

Resin molding and sensor device

Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Tsubasa Watanabe, Tokyo, JP;

Tsutomu Kono, Tokyo, JP;

Takayuki Yogo, Hitachinaka, JP;

Hiroaki Hoshika, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Stephen Bradley

Assistant Examiner:

Wasiul Haider

Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 23/10 (2006.01); G01F 1/684 (2006.01); G01F 1/692 (2006.01); H01L 23/28 (2006.01); H05K 1/02 (2006.01); B29C 45/14 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/04 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2006.01); F02D 41/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); B29C 45/14639 (2013.01); G01F 1/684 (2013.01); G01F 1/692 (2013.01); H01L 21/4817 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 23/041 (2013.01); H01L 23/13 (2013.01); H01L 23/28 (2013.01); H01L 23/3121 (2013.01); H01L 23/3185 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 25/165 (2013.01); H05K 1/02 (2013.01); F02D 41/18 (2013.01); G01F 1/6845 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A resin molding includes a semiconductor element, a circuit board, and a resin. A conductor connected to the semiconductor element is formed on the circuit board. The resin is adhered and integrated with the circuit board. A resin leakage suppression layer including a material having a higher thermal conductivity than that of a material forming a surface layer of the circuit board is provided in an edge region extending along a portion adhered to the resin in the circuit board and extending along at least one-side side surface of the resin.

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