The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
May. 13, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/49 (2006.01); H02M 7/00 (2006.01); H02M 7/53 (2006.01); H01L 23/057 (2006.01); H01L 23/28 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H02M 7/538 (2007.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/057 (2013.01); H01L 23/28 (2013.01); H01L 23/3114 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H02M 7/003 (2013.01); H02M 7/538 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14252 (2013.01); H02P 27/06 (2013.01);
Abstract
A semiconductor module is provided in which a semiconductor element is mounted and a plurality of outside connecting modules are drawn from a side of a mold resin portion. To ensure sufficient space for a holding tool used in mounting the semiconductor module to a device with a simple structure, holding side portions are provided for at least two opposing corner portions of corner portions between adjacent sides of the mold resin portion.