The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Mar. 20, 2014
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/552 (2006.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/53295 (2013.01); H01L 23/5226 (2013.01); H01L 23/552 (2013.01); H01L 33/44 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A stacked structure, includes: a wiring; an insulating layer; a substrate; and a protective layer, wherein the wiring, the insulating layer, and the substrate are stacked from a bottom side, and an end portion of the wiring is projected from a side face of the stacked structure, and the protective layer is provided between the insulating layer and at least a part of the wiring and is configured of a material different from a material configuring the insulating layer.