The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Apr. 04, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Cheng-Wei Cheng, White Plains, NY (US);

Sanghoon Lee, White Plains, NY (US);

Effendi Leobandung, Stormville, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76283 (2013.01); H01L 21/02381 (2013.01); H01L 21/02428 (2013.01); H01L 21/02488 (2013.01); H01L 21/02494 (2013.01); H01L 21/02538 (2013.01); H01L 21/02639 (2013.01); H01L 21/308 (2013.01); H01L 21/762 (2013.01); H01L 21/76272 (2013.01); H01L 29/0649 (2013.01); H01L 29/0665 (2013.01); H01L 29/20 (2013.01); H01L 29/66522 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01); H01L 29/7851 (2013.01);
Abstract

A method of making a dual isolation fin comprises applying a mask to a substrate and etching the exposed areas of the substrate to form a mandrel; forming a dielectric layer on the surface of the substrate and adjacent to the mandrel; forming a first epitaxially formed material on the exposed portions of the mandrel; forming a second epitaxially formed material on the first epitaxially formed material; forming a first isolation layer on the dielectric layer and adjacent to the second epitaxially formed material; removing the mask and mandrel after forming the first isolation layer; removing the first epitaxially formed material after removing the mask and mandrel; and forming a second isolation layer.


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