The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Jun. 27, 2018
Applicant:

Edison Welding Institute, Inc., Columbus, OH (US);

Inventors:

Alber Sadek, Dublin, OH (US);

Edward D. Herderick, Powell, OH (US);

Kirk E. Cooper, Worthington, OH (US);

Nathan D. Ames, Sunbury, OH (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B27G 11/02 (2006.01); B32B 37/00 (2006.01); C04B 33/34 (2006.01); G21C 3/07 (2006.01); B32B 37/06 (2006.01); B23K 26/20 (2014.01); B23K 37/00 (2006.01); B23K 1/008 (2006.01); C04B 35/565 (2006.01); C22C 21/02 (2006.01); C04B 37/02 (2006.01); C04B 37/00 (2006.01); B23K 1/005 (2006.01);
U.S. Cl.
CPC ...
G21C 3/07 (2013.01); B23K 1/008 (2013.01); B23K 1/0056 (2013.01); B23K 26/20 (2013.01); B23K 37/00 (2013.01); B32B 37/00 (2013.01); B32B 37/06 (2013.01); C04B 35/565 (2013.01); C04B 37/006 (2013.01); C04B 37/026 (2013.01); C22C 21/02 (2013.01); C04B 2235/3826 (2013.01); C04B 2237/121 (2013.01); C04B 2237/365 (2013.01); C04B 2237/40 (2013.01); C04B 2237/403 (2013.01); C04B 2237/59 (2013.01); C04B 2237/595 (2013.01); C04B 2237/60 (2013.01); C04B 2237/72 (2013.01); G21Y 2004/10 (2013.01); Y02E 30/40 (2013.01);
Abstract

A method for fabricating assemblies that includes providing a first component that further includes silicon carbide and that has an upper portion and a tapered lower portion; providing a second component that further includes silicon carbide and that has an upper portion that is adapted to receive the tapered lower portion of the first component; providing a predetermined amount of multiphase Al—Si braze foil; grinding the Al—Si braze foil into a powder; mixing a predetermined amount of braze paste binder with the Al—Si powder to form a slurry; uniformly applying the slurry to the tapered lower portion of the first component; uniformly applying the slurry to the upper portion of the second component and inserting the tapered lower portion of the first component into the upper portion of the second component; and heating the applied slurry to a temperature of 725° C. to 1450° C. for a predetermined period of time.


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