The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Aug. 18, 2015
Applicants:

Jongwook Jeon, Suwon-si, KR;

Yeoil Yun, Hwasung, KR;

Sangwoo Pae, Seongnam-si, KR;

Uihui Kwon, Hwaseong-si, KR;

Keunho Lee, Seongnam-si, KR;

Inventors:

Jongwook Jeon, Suwon-si, KR;

Yeoil Yun, Hwasung, KR;

Sangwoo Pae, Seongnam-si, KR;

Uihui Kwon, Hwaseong-si, KR;

Keunho Lee, Seongnam-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5036 (2013.01); G06F 2217/80 (2013.01);
Abstract

A method of designing a semiconductor circuit using a circuit simulation tool executed by a computer includes calculating power consumptions of elements of the semiconductor circuit by use of the circuit simulation tool. A thermal netlist is created about the semiconductor circuit, based on the power consumptions and geometry information of each of the elements. A simulation of the semiconductor circuit is performed with the thermal netlist using the circuit simulation tool to detect a temperature of each of the elements. The thermal netlist includes thermal capacitance information of each of the elements.


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