The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Aug. 25, 2015
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Masayuki Nagano, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 7/02 (2006.01); G02B 7/09 (2006.01); C22F 1/08 (2006.01); C22C 9/00 (2006.01); G03B 3/10 (2006.01);
U.S. Cl.
CPC ...
G02B 7/026 (2013.01); C22C 9/00 (2013.01); C22F 1/08 (2013.01); G02B 7/09 (2013.01); G03B 3/10 (2013.01);
Abstract

To provide a high-strength titanium-copper foil suitable as a conductive spring material that can be used in an electronic device component such as an autofocus camera module. A titanium copper foil containing Ti in an amount of 2.0 to 4.0 mass %, a remainder being copper and unavoidable impurities, said foil having a 0.2 % yield strength of 1200 MPa or more in both directions parallel and perpendicular to a rolling direction, and a spring limit value of 800 MPa or more in both directions parallel and perpendicular to the rolling direction.


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Nagano, Masayuki. (2019). High-strength titanium copper foil and method for producing same (U.S. Patent No. 10215950). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10215950

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