The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Apr. 30, 2018
Unistars Corporation, Zhudong Township, TW;
Shang-Yi Wu, Hsinchu, TW;
Hsin-Hsien Hsieh, Taoyuan, TW;
UNISTARS CORPORATION, Hsinchu, TW;
Abstract
An optoelectronic package includes a wiring substrate having a holding plane, an optoelectronic chip, a reflective material, an optical element and an adhesive. The optoelectronic chip is mounted on the holding plane and electrically connected to the wiring substrate. The optoelectronic chip has an upper surface, a functional region and a side surface connected to the upper surface. The reflective material is on the holding plane and surrounds the optoelectronic chip. The reflective material covers the side surface and has an inclined surface. The inclined surface surrounds the upper surface and extends from an edge of the upper surface. The height of the reflective material at the inclined surface decreases from the optoelectronic chip toward a direction away from the optoelectronic chip. The adhesive covers the reflective material and the upper surface and is connected between the optoelectronic chip and the optical element.