The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Dec. 31, 2015
University of Southern California, Los Angeles, CA (US);
Ming Ting Wu, Northridge, CA (US);
Rulon J. Larsen, III, Reseda, CA (US);
Young Kim, Sherman Oaks, CA (US);
Kieun Kim, Los Angeles, CA (US);
Adam L. Cohen, Dallas, TX (US);
Ananda H. Kumar, Fremont, CA (US);
Michael S. Lockard, Lake Elizabeth, CA (US);
Dennis R. Smalley, Newhall, CA (US);
University of Southern California, Los Angeles, CA (US);
Abstract
Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.