The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Mar. 27, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Byeong Hyeon Yu, Seoul, KR;

Wook Pyo Lee, Cheonan-si, KR;

Ariyoshi Tetsuo, Suwon-si, KR;

Ji Hoon Yun, Seoul, KR;

Cheon Ho Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/64 (2016.01); F21K 9/69 (2016.01); F21K 9/90 (2016.01); F21V 9/00 (2018.01); F21K 9/275 (2016.01); F21V 29/74 (2015.01); F21V 29/76 (2015.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 9/00 (2013.01); F21K 9/275 (2016.08); F21K 9/64 (2016.08); F21K 9/69 (2016.08); F21K 9/90 (2013.01); F21V 29/74 (2015.01); F21V 29/763 (2015.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); Y10T 29/4913 (2015.01);
Abstract

A lighting device in which a heat sink and a cover are formed by co-extrusion and a manufacturing method for the same are provided. The heat sink and the cover may be co-extruded. A shape control portion may be formed at the heat sink to control a shape of a seating portion to seat a circuit substrate during extrusion of the heat sink. In addition, a light characteristic control portion may be provided between a light emitting diode (LED) and the cover to control characteristic of light generated from the LED.


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