The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Nov. 12, 2013
Applicant:

Sika Technology Ag, Baar, CH;

Inventors:

Tina Voci, Zürich, CH;

David Hofstetter, Winterthur, CH;

Christian Krüger, Schlieren, CH;

Jan Olaf Schulenburg, Uster, CH;

Assignee:

SIKA TECHNOLOGY AG, Baar, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 18/40 (2006.01); C08G 18/48 (2006.01); C08G 18/69 (2006.01); C08G 18/12 (2006.01); C09J 175/04 (2006.01); C08G 18/75 (2006.01); C09J 9/00 (2006.01); C09J 11/08 (2006.01); C09J 163/00 (2006.01);
U.S. Cl.
CPC ...
C08G 18/4063 (2013.01); C08G 18/12 (2013.01); C08G 18/4854 (2013.01); C08G 18/698 (2013.01); C08G 18/755 (2013.01); C09J 9/00 (2013.01); C09J 11/08 (2013.01); C09J 163/00 (2013.01); C09J 175/04 (2013.01);
Abstract

An epoxy group-terminated impact modifier is described, comprising the reaction product of a) two or more polyols, b) one or more polyisocyanates, and c) at least one epoxy resin comprising a primary or secondary hydroxy group-containing epoxy compound, wherein the polyols comprise a1) at least one polyether polyol and a2) at least one OH-terminated rubber, wherein the weight ratio of polyether polyol to OH-terminated rubber is in the range from 7:3 to 2:8; an isocyanate-terminated prepolymer as possible intermediate product is described; furthermore a method for producing same is described. The products obtained are suitable for improving the impact resistance of epoxy resin compositions, in particular of 1K or 2K epoxy resin adhesives.


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