The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Nov. 04, 2014
Applicant:

Corning Precision Materials Co., Ltd., Chungcheongnam-do, KR;

Inventors:

Shin Kim, Chungcheongnam-do, KR;

Ki Nam Kim, Chungcheongnam-do, KR;

Mun Hwan Seol, Chungcheongnam-do, KR;

Dong Young Cho, Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03B 23/00 (2006.01); B65H 23/188 (2006.01); B65H 29/52 (2006.01); C03B 33/023 (2006.01); B26D 7/08 (2006.01); B26D 7/22 (2006.01); B24B 7/24 (2006.01); B24B 41/06 (2012.01); B65H 5/00 (2006.01); C03C 17/00 (2006.01); B65H 5/38 (2006.01); B65G 49/06 (2006.01); C03B 35/24 (2006.01);
U.S. Cl.
CPC ...
C03B 23/00 (2013.01); B24B 7/24 (2013.01); B24B 41/06 (2013.01); B26D 7/086 (2013.01); B26D 7/22 (2013.01); B65G 49/065 (2013.01); B65G 49/066 (2013.01); B65H 5/008 (2013.01); B65H 5/38 (2013.01); B65H 23/188 (2013.01); B65H 29/52 (2013.01); C03B 33/0235 (2013.01); C03B 35/246 (2013.01); C03C 17/001 (2013.01); B65H 2404/611 (2013.01); B65H 2515/50 (2013.01); B65H 2601/125 (2013.01); B65H 2601/51 (2013.01); B65H 2801/61 (2013.01); B65H 2801/87 (2013.01);
Abstract

The present invention provides a non-contact vibration suppression device comprising a first ultrasonic vibration unit and a second ultrasonic vibration unit, the device being characterized in that the first ultrasonic vibration unit and the second ultrasonic vibration unit are installed to face each other while being spaced from each other such that an object can be interposed therebetween, the first ultrasonic vibration unit and the second ultrasonic vibration unit generate ultrasonic vibrations, respectively, and apply repulsive forces, which result from the ultrasonic vibrations, to the object such that the object is constrained with no contact between the first ultrasonic vibration unit and the second ultrasonic vibration unit, thereby suppressing vibration of the object. In addition, the present invention provides an object processing method characterized by comprising the steps of: suppressing vibration of the object using the non-contact vibration suppression device; and processing the object, vibration of which has been suppressed.


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