The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Jul. 11, 2016
Applicant:
Motion Engine, Inc., Montreal, CA;
Inventors:
Robert Mark Boysel, Montreal, CA;
Louis Ross, Montreal, CA;
Assignee:
Motion Engine, Inc., Montreal, CA;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); G01P 15/125 (2006.01); G01P 15/18 (2013.01); G01P 15/08 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81C 1/00238 (2013.01); G01P 15/0802 (2013.01); G01P 15/125 (2013.01); G01P 15/18 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0278 (2013.01); B81B 2201/0292 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); H01L 2224/16145 (2013.01);
Abstract
An integrated MEMS system having a MEMS chip, including a MEMS transducer, and at least one IC chip, including MEMS processing circuitry, and additional circuitry to process electrical signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducer and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct electrical signals to the IC chip, to be processed by additional circuitry.