The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

Feb. 19, 2018
Applicant:

Magna Electronics Inc., Auburn Hills, MI (US);

Inventors:

Garret F. Achenbach, Rochester Hills, MI (US);

Brian A. Gorman, Burton, MI (US);

Brian F. Smith, Macomb, MI (US);

Steven G. Gebauer, Oxford, MI (US);

Assignee:

MAGNA ELECTRONICS INC., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 9/47 (2006.01); H04N 7/18 (2006.01); B60R 11/04 (2006.01); H05K 7/20 (2006.01); B60R 1/00 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
B60R 11/04 (2013.01); B60R 1/00 (2013.01); H04N 5/2257 (2013.01); H04N 7/181 (2013.01); H05K 7/2039 (2013.01);
Abstract

A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.


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