The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Dec. 11, 2014
Applicants:
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Fuji Resin Co., Ltd., Amagasaki-shi, Hyogo, JP;
Inventors:
Kentaro Shindo, Tokyo, JP;
Takao Kuroiwa, Tokyo, JP;
Hidehiko Gensui, Amagasaki, JP;
Manabu Yamaguchi, Amagasaki, JP;
Assignees:
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
FUJI RESIN CO., LTD., Amagasaki-Shi, Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/20 (2006.01); B32B 7/06 (2006.01); B64C 3/00 (2006.01); F04D 29/18 (2006.01); F04D 29/38 (2006.01); B64C 11/20 (2006.01); B32B 7/12 (2006.01); B32B 27/30 (2006.01); B32B 27/08 (2006.01); B32B 5/02 (2006.01);
U.S. Cl.
CPC ...
B32B 27/20 (2013.01); B32B 5/024 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/30 (2013.01); B32B 27/306 (2013.01); B64C 3/00 (2013.01); B64C 11/205 (2013.01); F04D 29/181 (2013.01); F04D 29/38 (2013.01); B32B 2260/021 (2013.01); B32B 2262/101 (2013.01); B32B 2264/102 (2013.01); B32B 2264/105 (2013.01); B32B 2264/107 (2013.01); B32B 2307/41 (2013.01); B32B 2307/554 (2013.01); B32B 2405/00 (2013.01); B32B 2556/00 (2013.01); B32B 2571/00 (2013.01); B32B 2605/18 (2013.01);
Abstract
An anti-wear sheet for improving anti-wear performance of an object to be protected includes: a release film; a resin layer disposed on the release film and including photo-curable resin and hard particles supported by the photo-curable resin; and a light-shielding film disposed on an opposite side of the resin layer from the release film.