The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
May. 08, 2015
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
Morteza Safai, Newcastle, WA (US);
Kimberly Meredith, Newcastle, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/08 (2006.01); B29C 65/00 (2006.01); B29C 65/48 (2006.01); B29C 73/10 (2006.01); B29C 73/12 (2006.01); B29C 73/34 (2006.01); B29C 35/02 (2006.01); B29L 31/30 (2006.01); B29L 31/00 (2006.01); B29C 65/50 (2006.01); B29C 73/14 (2006.01); B29C 65/82 (2006.01); B29L 31/10 (2006.01);
U.S. Cl.
CPC ...
B29C 66/721 (2013.01); B29C 35/0261 (2013.01); B29C 65/08 (2013.01); B29C 65/4835 (2013.01); B29C 66/474 (2013.01); B29C 66/9121 (2013.01); B29C 66/9141 (2013.01); B29C 73/10 (2013.01); B29C 73/12 (2013.01); B29C 73/34 (2013.01); B29C 65/088 (2013.01); B29C 65/5028 (2013.01); B29C 65/5057 (2013.01); B29C 65/8292 (2013.01); B29C 66/1222 (2013.01); B29C 66/1226 (2013.01); B29C 66/472 (2013.01); B29C 66/5326 (2013.01); B29C 66/71 (2013.01); B29C 66/7212 (2013.01); B29C 66/72141 (2013.01); B29C 66/73941 (2013.01); B29C 66/81422 (2013.01); B29C 66/836 (2013.01); B29C 66/8412 (2013.01); B29C 66/86533 (2013.01); B29C 66/91216 (2013.01); B29C 66/91411 (2013.01); B29C 66/91951 (2013.01); B29C 66/951 (2013.01); B29C 66/9512 (2013.01); B29C 66/9516 (2013.01); B29C 66/961 (2013.01); B29C 66/9674 (2013.01); B29C 73/14 (2013.01); B29L 2031/10 (2013.01); B29L 2031/30 (2013.01); B29L 2031/3055 (2013.01); B29L 2031/3067 (2013.01); B29L 2031/3076 (2013.01); B29L 2031/3082 (2013.01); B29L 2031/3091 (2013.01); B29L 2031/7126 (2013.01); B29L 2031/7692 (2013.01);
Abstract
A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object and heating the bond interface with sound waves. Heating the bond interface may include applying ultrasonic sound waves to the bond interface.