The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2019

Filed:

May. 20, 2015
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Nikhil Padhye, Sunnyvale, CA (US);

David Moore Parks, Pembroke, MA (US);

Bernhardt Levy Trout, Lexington, MA (US);

Alexander H. Slocum, Bow, NH (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29K 1/00 (2006.01); C09J 5/00 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); B29C 65/14 (2006.01); B29C 65/72 (2006.01); B29C 65/82 (2006.01); B29K 23/00 (2006.01); B29K 25/00 (2006.01); B29K 31/00 (2006.01); B29K 33/00 (2006.01); B29K 69/00 (2006.01); B29K 83/00 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); G05G 15/08 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/02 (2013.01); B29C 65/004 (2013.01); B29C 65/006 (2013.01); B29C 65/1432 (2013.01); B29C 65/72 (2013.01); B29C 65/8215 (2013.01); B29C 65/8223 (2013.01); B29C 65/8253 (2013.01); B29C 66/1122 (2013.01); B29C 66/341 (2013.01); B29C 66/43 (2013.01); B29C 66/45 (2013.01); B29C 66/73921 (2013.01); B29C 66/8223 (2013.01); B29C 66/8227 (2013.01); B29C 66/83411 (2013.01); B29C 66/83413 (2013.01); B29C 66/91945 (2013.01); B29C 66/9221 (2013.01); B29C 66/9261 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); C09J 5/00 (2013.01); G05G 15/08 (2013.01); B29C 66/71 (2013.01); B29C 66/73121 (2013.01); B29C 66/73151 (2013.01); B29C 66/8161 (2013.01); B29K 2105/0038 (2013.01); B32B 2037/0092 (2013.01); B32B 2309/02 (2013.01); C09J 2400/226 (2013.01);
Abstract

Methods and apparatuses for bonding polymeric parts are disclosed. Specifically, in one embodiment, the polymeric parts are bonded by plastically deforming them against each other while they are below the glass transition temperatures. A method includes: placing a first polymeric part in contact with a second polymeric part; and plastically deforming the first polymeric part and the second polymeric part against each other to bond the first polymeric part to the second polymeric part. Additionally, during the plastic deformation, a temperature of the first polymeric part is less than a glass transition temperature of the first polymeric part and a temperature of the second polymeric part is less than a glass transition temperature of the second polymeric part.


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