The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Jan. 27, 2017
Applicant:
Diamond Innovations, Inc., Worthington, OH (US);
Inventor:
Andrew Gledhill, Westerville, OH (US);
Assignee:
DIAMOND INNOVATIONS, INC., Worthington, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/10 (2006.01); B22F 3/14 (2006.01); B22F 3/24 (2006.01); B22F 3/26 (2006.01); B22F 5/00 (2006.01); B22F 7/00 (2006.01); B22F 7/06 (2006.01); B28B 11/08 (2006.01); E21B 10/567 (2006.01); C22C 26/00 (2006.01); C04B 35/52 (2006.01); C04B 35/638 (2006.01); C04B 41/00 (2006.01); C04B 41/50 (2006.01); C04B 41/87 (2006.01); C22C 1/10 (2006.01);
U.S. Cl.
CPC ...
B22F 7/008 (2013.01); B22F 3/10 (2013.01); B22F 3/24 (2013.01); B22F 3/26 (2013.01); B28B 11/08 (2013.01); C04B 35/52 (2013.01); C04B 35/638 (2013.01); C04B 41/009 (2013.01); C04B 41/50 (2013.01); C04B 41/87 (2013.01); C22C 26/00 (2013.01); E21B 10/567 (2013.01); B22F 2003/244 (2013.01); B22F 2005/001 (2013.01); B22F 2302/406 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C04B 2235/427 (2013.01); C04B 2235/616 (2013.01); C04B 2235/85 (2013.01); C22C 1/1094 (2013.01); C22C 2026/006 (2013.01); C22C 2026/007 (2013.01); C22C 2026/008 (2013.01);
Abstract
Polycrystalline diamond compacts having parting compound within the interstitial volumes are disclosed herein. In one embodiment, a polycrystalline diamond compact includes a polycrystalline diamond body having a plurality of diamond grains bonded together in diamond-to-diamond bonds, interstitial volumes positioned between the adjacent diamond grains, and a parting compound positioned in at least a portion of the interstitial volumes of the polycrystalline diamond body.