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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10212856 B1

PDFFull Text
Date of Patent:
Feb. 19, 2019

Filed:

Feb. 16, 2016

Water cooling system of single board module level

Applicant:

Zte Corporation, Guangdong, CN;

Inventors:

Wenbing Jiang, Guangdong, CN;

Jianfeng Li, Guangdong, CN;

Assignee:

ZTE CORPORATION, Guandong, CN;

Attorneys:

Nath, Goldberg & Meyer

Joshua B. Goldberg

Primary Examiner:

Adrian S Wilson

Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); H01L 23/34 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20772 (2013.01); G06F 1/20 (2013.01); H01L 23/34 (2013.01); H05K 7/20272 (2013.01); H05K 7/20781 (2013.01); H05K 7/20836 (2013.01); G06F 2200/201 (2013.01); H05K 7/1489 (2013.01);
Abstract

A water cooling system of single board module level comprises: a device subrack (), provided with a backplate (); multiple single board modules (), located on one side of the backplate (); multiple single board water-cooling modules (), mounted on the corresponding board modules () and having liquid for cooling a heating element of the single board modules (); multiple sealing plug-connection units () mounted on the backplate () and connected to the single board water-cooling modules (); and multiple water pump modules () connected to the multiple single board water-cooling modules () by means of the multiple sealing plug-connection units (), wherein the water pump modules () are located on the other side of the backplate (). The water cooling system of single board module level has a simple structure, saves space, and has a high device maintenance efficiency.

Find Patent Forward Citations

Jiang, Wenbing. (2019). Water cooling system of single board module level (U.S. Patent No. 10212856). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10212856

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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