The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Mar. 14, 2018
Applicant:

Aptiv Technologies Limited, St. Michael, BB;

Inventors:

Matthias Rieke, Moenchengladbach, DE;

Volker Klink, Hennef, DE;

Florin Badarau-Trescovan, Remscheid, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 5/02 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/147 (2013.01); H05K 1/0203 (2013.01); H05K 5/0204 (2013.01); H05K 5/0213 (2013.01); H05K 7/1427 (2013.01); H05K 7/1434 (2013.01); H05K 7/20145 (2013.01); H05K 7/20154 (2013.01); H05K 7/20854 (2013.01); H05K 7/20863 (2013.01); H05K 1/184 (2013.01); H05K 2201/056 (2013.01); H05K 2201/058 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10901 (2013.01); H05K 2201/10939 (2013.01);
Abstract

An electronic device for a vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.


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