The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

May. 28, 2015
Applicant:

Tecnomar Oy, Espoo, FI;

Inventor:

Tom Marttila, Espoo, FI;

Assignee:

TECNOMAR OY, , FI;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); G08B 13/24 (2006.01); B32B 38/10 (2006.01); H05K 3/04 (2006.01); B32B 37/12 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); B32B 38/10 (2013.01); G08B 13/244 (2013.01); H05K 3/046 (2013.01); B32B 37/1292 (2013.01); B32B 2310/0843 (2013.01); B32B 2457/08 (2013.01); H05K 1/0366 (2013.01); H05K 1/0386 (2013.01); H05K 3/027 (2013.01); H05K 3/386 (2013.01); H05K 3/4084 (2013.01); H05K 2201/0284 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0522 (2013.01); H05K 2203/1545 (2013.01); Y10T 29/49156 (2015.01);
Abstract

A laminate contains conductive circuit patterns, a substrate material, and an adhesive pattern or other bond. Each conductive circuit pattern and the substrate material are interconnected by the adhesive pattern or other bond, having its size and shape substantially matching the main outlines of each conductive circuit pattern. Each conductive circuit pattern has thin lines and thin interline spaces, patterned on top of the adhesive pattern or other bond by a removal of conductive material, such that the circuit pattern's thin interline spaces may have residues of the adhesive patterns or other bond. Outside the conductive circuit patterns' main outlines, the substrate material is substantially void of an adhesive or other bond, with the exception of edge areas of the main outlines.


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