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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10212814 B1

PDFFull Text
Date of Patent:
Feb. 19, 2019

Filed:

Feb. 27, 2013

Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventor:

Kazuhiro Yoshikawa, Saitama, JP;

Assignee:

MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Humera N Sheikh

Assistant Examiner:

Xiaobei Wang

Int. Cl.
CPC ...
C25D 5/10 (2006.01); B32B 15/20 (2006.01); B32B 7/06 (2006.01); H05K 1/09 (2006.01); B32B 15/04 (2006.01); C25D 1/04 (2006.01); C25D 1/22 (2006.01); C25D 3/38 (2006.01); C25D 7/06 (2006.01); H05K 3/02 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01); B23K 26/40 (2014.01); B23K 26/382 (2014.01); C25D 3/02 (2006.01); C25D 3/12 (2006.01); C25D 5/12 (2006.01); C25D 9/08 (2006.01); B23K 103/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B23K 26/382 (2015.10); B23K 26/40 (2013.01); B32B 7/06 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); C25D 1/04 (2013.01); C25D 1/22 (2013.01); C25D 3/38 (2013.01); C25D 7/0614 (2013.01); H05K 3/007 (2013.01); H05K 3/025 (2013.01); H05K 3/385 (2013.01); B23K 2103/12 (2018.08); B32B 2307/42 (2013.01); B32B 2307/538 (2013.01); B32B 2307/748 (2013.01); C25D 3/12 (2013.01); C25D 5/12 (2013.01); C25D 9/08 (2013.01); H05K 2201/032 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/107 (2013.01); Y10T 428/12049 (2015.01);
Abstract

An object of the present invention is to improve the laser drilling performance of a copper clad laminate whose black-oxide treated surface is used as a laser drilled surface. To achieve the object, a copper foil provided with a carrier foilcomprising a layer structure of the carrier foil/the releasing layer/the bulk copper layercharacterized in that metal element-containing particlesare disposed between the releasing layerand the bulk copper layeris employed. If the present copper foil provided with a carrier foil is used, a black-oxide treated layer having a color tone excellent in the laser drilling performance can be formed on the surface of the bulk copper layer in the copper clad laminate manufactured.

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