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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10212813 B1

PDFFull Text
Date of Patent:
Feb. 19, 2019

Filed:

Apr. 07, 2011

Resin composition, prepreg, and laminated sheet

Applicants:

Takaaki Ogashiwa, Kashima, JP;

Hiroshi Takahashi, Misato, JP;

Tetsuro Miyahira, Shirakawa, JP;

Yoshihiro Kato, Abiko, JP;

Inventors:

Takaaki Ogashiwa, Kashima, JP;

Hiroshi Takahashi, Misato, JP;

Tetsuro Miyahira, Shirakawa, JP;

Yoshihiro Kato, Abiko, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Coris Fung

Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/38 (2006.01); H05K 1/05 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01); C08J 5/24 (2006.01); C09D 163/00 (2006.01); C08K 3/22 (2006.01); C08L 63/00 (2006.01); C08L 71/00 (2006.01); C09D 171/00 (2006.01); C08K 5/3415 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); C08G 59/4042 (2013.01); C08G 59/621 (2013.01); C08J 5/24 (2013.01); C08K 3/22 (2013.01); C08L 63/00 (2013.01); C08L 71/00 (2013.01); C09D 163/00 (2013.01); C09D 171/00 (2013.01); C08J 2363/00 (2013.01); C08K 3/013 (2018.01); C08K 5/3415 (2013.01); Y10T 428/31529 (2015.04);
Abstract

There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

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