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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10212810 B1

PDFFull Text
Date of Patent:
Feb. 19, 2019

Filed:

Jun. 05, 2017

Printed wiring board and method of producing the same

Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventors:

Takanori Ohara, Tokyo, JP;

Kyoichi Yamamoto, Tokyo, JP;

Kentaro Kubota, Tokyo, JP;

Kenji Hayashi, Tokyo, JP;

Assignee:

TOPPAN PRINTING CO., LTD., Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/12 (2006.01); H05K 1/16 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 3/20 (2006.01); H05K 3/22 (2006.01); H05K 3/24 (2006.01); H05K 3/32 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H05K 1/0284 (2013.01); H05K 1/0386 (2013.01); H05K 1/092 (2013.01); H05K 1/095 (2013.01); H05K 1/16 (2013.01); H05K 3/0014 (2013.01); H05K 3/103 (2013.01); H05K 3/12 (2013.01); H05K 3/1275 (2013.01); H05K 3/207 (2013.01); H05K 3/22 (2013.01); H05K 3/245 (2013.01); H05K 3/32 (2013.01); H05K 3/38 (2013.01); H05K 3/4664 (2013.01); H05K 3/4046 (2013.01); H05K 2201/0293 (2013.01); H05K 2203/1545 (2013.01); H05K 2203/302 (2013.01);
Abstract

An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

Find Patent Forward Citations

Ohara, Takanori. (2019). Printed wiring board and method of producing the same (U.S. Patent No. 10212810). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10212810

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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