The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Nov. 09, 2017
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Tetsuro Yamada, Kawasaki, JP;

Akiko Matsui, Meguro, JP;

Mitsuhiko Sugane, Ichikawa, JP;

Takahide Mukoyama, Kamakura, JP;

Yoshiyuki Hiroshima, Nakano, JP;

Kohei Choraku, Yokohama, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H05K 1/0265 (2013.01); H05K 1/115 (2013.01); H05K 1/116 (2013.01); H05K 1/181 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/15311 (2013.01); H05K 1/113 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/09463 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A printed circuit board includes a power feeding layer to which a power supply voltage is applied, a plurality of power feeding terminals that is disposed in an area, in which an electronic component is mounted, and supplies current based on the power supply voltage to the electronic component, and a plurality of vias that electrically interconnects the plurality of power feeding terminals and the power feeding layer, and is formed such that a via coupled to a power feeding terminal disposed closer to an end of the area has a smaller via-diameter.


Find Patent Forward Citations

Loading…