The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Oct. 28, 2015
Applicant:

Ciena Corporation, Hanover, MD (US);

Inventors:

Michael Y. Frankel, Bethesda, MD (US);

John P. Mateosky, West River, MD (US);

Vladimir Pelekhaty, Baltimore, MD (US);

Assignee:

Ciena Corporation, Hanover, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04Q 11/00 (2006.01);
U.S. Cl.
CPC ...
H04Q 11/0005 (2013.01); H04Q 2011/0018 (2013.01); H04Q 2011/0058 (2013.01);
Abstract

A high port count switching module includes a plurality of switching circuits disposed on a glass interposer, wherein the plurality of switching circuits each include cross-point switches configured to perform switching at a full signal rate; and a plurality of optical transceivers disposed on the glass interposer and communicatively coupled to the plurality of switching circuits. The glass interposer has i) a low dielectric loss, relative to a silicon, organic, or ceramic interposer, to allow wideband data transmission, ii) a smooth surface, resulting in smooth metal traces to minimize high-frequency skin effect loss, iii) a coefficient of thermal expansion that is matched to the plurality of switching circuits to minimize stresses, and iv) thermal isolation among the plurality of switching circuits due to low thermal conductivity of glass.


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