The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

May. 01, 2018
Applicant:

Multidyne Electronics, Inc., Hauppauge, NY (US);

Inventor:

Francis P. Jachetta, Oyster Bay, NY (US);

Assignee:

Multidyne Electronics, Inc., Hauppauge, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); H04B 10/43 (2013.01); H04B 10/80 (2013.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H04B 10/43 (2013.01); G02B 6/4261 (2013.01); G02B 6/4292 (2013.01); H04B 10/801 (2013.01); G02B 6/4246 (2013.01); G02B 6/4284 (2013.01);
Abstract

An apparatus in one embodiment comprises a first stackable transmitter/receiver module. The first stackable transmitter/receiver module comprises a housing having first and second ends and multiple sides between the first and second ends, a first signal connector arranged at the first end of the housing, a second signal connector arranged at the second end of the housing, and one or more sets of interconnects arranged on respective ones of the sides of the housing. The first stackable transmitter/receiver module is configured for mated stacking with one or more additional stackable transmitter/receiver modules via the one or more sets of interconnects. A given one of the sets of interconnects of the first transmitter/receiver module is configured to mate with a corresponding complementary set of interconnects arranged on a side of a housing of one of the additional stackable transmitter/receiver modules when the first and additional modules are stacked.


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