The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2019

Filed:

Sep. 17, 2014
Applicant:

Daishinku Corporation, Kakogawa-shi, Hyogo, JP;

Inventors:

Tomo Fujii, Kakogawa, JP;

Kozo Shibutani, Kakogawa, JP;

Satoru Ishino, Kakogawa, JP;

Yoshinari Morimoto, Kakogawa, JP;

Tadataka Koga, Kakogawa, JP;

Kazuki Otani, Kakogawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/047 (2006.01); H01L 41/09 (2006.01); H01L 41/22 (2013.01); H03H 9/21 (2006.01); H03H 9/05 (2006.01); H03H 9/215 (2006.01); H01L 41/053 (2006.01); H01L 41/33 (2013.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0595 (2013.01); H01L 41/0475 (2013.01); H01L 41/053 (2013.01); H01L 41/33 (2013.01); H03H 3/02 (2013.01); H03H 9/02393 (2013.01); H03H 9/10 (2013.01); H03H 9/21 (2013.01); H03H 9/215 (2013.01); H03H 2003/026 (2013.01);
Abstract

This piezoelectric wafer has: a piezoelectric vibration piece; a frame portion that supports the piezoelectric vibration piece; and a coupling portion that couples the piezoelectric vibration piece to the frame portion. The piezoelectric vibration piece is broken off at the coupling portion and separated from the piezoelectric wafer. On front and back surfaces of the coupling portion, grooved slits extending along a width direction of the coupling portion are formed except for parts of the coupling portion in the width direction. An electrode on at least one of front and back surfaces of the piezoelectric vibration piece is extracted to a frame-portion side of the piezoelectric wafer by way of the part of the coupling portion in the width direction.


Find Patent Forward Citations

Loading…